CW021A | Cu-HCP

C103 | High Conductivity Copper

Available formats: Plates, Plates and Plates.

features

C103 | Cu-HCP is used in applications with a demand for high electrical and thermal conductivity. Also in the use of parts to weld or weld. It is also used for plating. Application examples: devices for electricity and electronics, die casting of die bars for brazing.

 

Good persistence in the natural atmosphere (also in marine air) and in the industrial atmosphere (dark res., Green spots on the surface), tap and drinking water, aqueous and alkaline solutions (without oxidant), pure steam, non-acidic oxidants (as far as there is no oxygen). in solution) and neutral solutions of salts.

 

The C103 | Cu-HCP can be tempered in an atmosphere containing hydrogen without risk of embrittlement. Intensity against stress corrosion cracking. Without persistence in solutions of cyanides, halides and ammonia, oxidizing acids, liquid ammonia, halogen gas, hydrogen sulfide and water.

 

The C103 | Cu-HCP is a low purity, high level residual phosphorus deoxidized copper. It has a very high electrical and thermal conductivity, good soldering and soldering properties, as well as resistance to hydrogen. It has excellent hot and cold forming properties, and good corrosion resistance in water and especially in the atmosphere (including the industrial atmosphere).

Applications

Electric
High frequency cable, submarine cable strips, waveguide tube, standard material for longitudinally welded cables, switches, applications requiring high conductivity, tube bus, electrical conductors, clad products, bus bars, terminals, thermostatic control tubes.

 

Industrial
Applications requiring good welding, applications requiring good weldability, pressure vessels, billet mold tube, extrusion cans for powder metallurgy.

 

The electrical conductivity is strongly influenced by the chemical composition. A high level of cold deformation and a small grain size decrease electrical conductivity moderately. Minimum conductivity level can be specified

 

Resistant to: Atmospheric corrosion: formation of a greenish protective patina due to the formation of basic copper salts (such as sulfates, chlorides in the marine environment, nitrates and carbonates)

Water (industrial and drinkable). Aqueous and alkaline solutions (non-oxidizing), pure water vapor (steam), non-oxidizing acids (without oxygen in solution), neutral saline solutions.

The material can be heat treated in a reducing atmosphere.

 

Insensitive to stress corrosion cracking.

 

Not resistant to: oxidizing acids, solutions containing cyanides, ammonia or halogens, hydrated ammonia and halogenated gases, hydrogen sulfide, sea water.

Chemical composition

>

%
Cu
Al
Bi
Co
OR
Fe
P
Pb
Si
Zr
Others

Min.

99,95

-

-

-

-

-

0,002

-

-

-

-

Max.

-

-

0,0005

-

-

-

0,007

0,005

-

-

0,03

Chemical composition according to EN 12163

Chemical composition

Element
Min.%
Max. %

Cu


Al


Bi


Co


OR


Fe


P


Pb


Si


Zr


Others / Alloys

99,95


-


-


-


-


-


0,002


-


-


-


-

-


-


0,0005


-


-


-


0,007


0,005


-


-


0,03

Chemical composition according to EN 12163

International Equivalences

BRONCESVAL
ISO
W Nr / DIN
ASTM (UNS)
UNE
BS
DIN / ISO
DIN OLD

C103

Cu-HCP

CW021A

C10300

CU HCP

C103

SE-CU

2.0070

Mechanical properties

Tensile strength
(MPa)
Elastic limit
0.2 % (MPa)
Elongation
minimum W50mm
Electric conductivity
% IACS (b) max.
Hardness
Hv
Specific weight
Approx. g / cm3

200 to? 360

? 100 a? 320

(? 2.5 mm) 42 to 2

96.6 to 100

40 a? 110

8,9

*For information only. | from R200 to R360 | (b) IACS: International Annealed Copper Standard | Typical values in annealing temper at 20 ° C

International Equivalences

BRONCESVAL C103
ISO Cu-HCP
W Nr / DIN CW021A
ASTM (UNS) C103000
UNE CU ETP
BS C103
DIN / ISO SE-CU
DIN OLD 2.0070

Mechanical properties

Tensile strength (MPa) 200 to? 360
Elastic limit 0.2 % (MPa) ? 100 a? 320
Minimum elongation W50mm
(? 2.5 mm) 42 to 2
Electrical conductivity % IACS (b) max. 94.8 to 98.3
Brinell hardness (HV) 40 a? 110
Specific Weight Approx. g / cm3 8,93

*For information only. | from R200 to R360 | (b) IACS: International Annealed Copper Standard | Typical values in annealing temper at 20 ° C

General Physical Properties

Thermal expansion coefficient from -191ºC to 16 ° C 16.9 10-6 / K
Thermal expansion coefficient from 0ºC to 300 ° C 17.7 10-6 / K
Specific heat capacity 0.385 J / (g · K)
Thermal conductivity 385 W / (m · K)
Electrical conductivity (1 MS / m = 1 m / (? Mm²) ? 57 MS / m
Electrical conductivity (IACS) 98 %
Thermal coefficient of electrical resistance (0 .. 200 ° C) 3.7 10-3 / K
Modulus of elasticity (1 GPa = 1 kN / mm²) cold annealed 132 GPa

Typical values in annealing temper at 20 ° C

Manufacturing Properties

Cold forming properties Excellent
Hot forming properties at 750º C to 950 ° C Good
Machinability (rating 20) Less suitable
Electroplating properties Excellent
Hot tin plating properties Excellent
Smooth welding Excellent
Resistance welding Less suitable
Arc welding with gas protection Excellent
Laser welding Fair
Soft annealed 250ºC to 650 ° C
Annealed to relieve stress 150ºC to 200 ° C

During heating in a reducing atmosphere, hydrogen can penetrate into copper and react with Cu oxide to water vapor. Its pressure can cause fragility.

Formats

  • C103 Copper Plates
  • C103 Copper Plates
  • Copper Plates C103

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